» Automated Optical Inspection Tools

IWTS-AOI-DCA-IDX

Powered by artificial intelligence & machine learning, Innowave's IWTS-AOI-DCA-IDX is built for fast automated wafer detection and classification. IWTS-AOI-DCA-IDX's accurate automated inspection tool is specially designed for 8-inch macro and micro wafer inspections without the need of human intervention.

IWTS-AOI-DCA-IDX is equipped with a high-end optics, aligner, precision stage and a rotary transport arm for efficient movement of wafers. Clarity of defects detected for macro and micro is up to 50 µm and 2µm respectively.
  • Key Features
  • Main Functions
  • Product Specifications
  • Application Examples
IWTS-AOI-DCA

Key Features

Efficient macro and micro inspection

  • All visible and small wafer defects will be captured in one cycle which is capable of running for 24 hours per day.

High-resolution images

  • Equipped with 2 different types of cameras and lens, high-resolution clear images can be captured quickly.
  • These images can be transferred to a centralized server to be viewed remotely.

Multiple detection of defects at high accuracy

  • Scratches, discolouration and bad spin can be detected at the macro level.
  • Smaller defects presented in OCR, die can be detected at the micro level.
IWTS-AOI-DCA

Main Functions

Fast automated inspection of defects on patterned wafer side

Macro and micro inspection are both performed without the need of human intervention. Our custom in-house developed algorithm is capable of detecting foreign material, scratches, discolouration, and many more.

Output results to centralized server

The defect inspection results in the form of images and statistics can be pushed to a centralized database, from which users can query and view.

User friendly dashboard for viewing

A customized dashboard can be catered for, so that users can quickly access key information and statistics remotely, through the staff Intranet or internal Cloud.
IWTS-AOI-DCA

Product Specifications

Machine Size
140 cm (L) x 120 cm (W) x 145 cm (H)
Wafer Size
8"
Wafer Material
Silicon
Aligner
Present
Loading/Wafer Stage
Automated high-precision movable X-Y stage up to 15 µm
UPH
50*
(*Based on optimal reel quality and minimal inspection criteria)
Network
Ethernet, SECS/GEM Ready
Recipe Handling
Automated recipe selection
Inspection
Macro
Micro
Camera Resolution
26MP
25.3MP
Camera Type
Colour
Monochrome
Lens
f=35 mm
2.0x telecentric lens
Lighting
Coaxial Light
Round Ring Light, 45" angle
Inspection Criteria
Stains, bad spin/discolouration, pattern distortion, particles, scratches, uneven EBR, chipping, OCR. 
EBR measurement, OCR window, mask ID, locking corner, XPA/PM marks, Scribe line, Dies.
Min. Detectable Defect Size
IWTS-AOI-DCA

Application Examples

  • Automated Wafer Inspection at macro and micro levels