Computer vision is used in the field of artificial intelligence where computers can classify products or derive information from visual inputs. This reduces the need for human involvement. With computer vision, smart recognition can easily be achieved together with intelligent prediction of customised products for our customers.
A successful implementation of Computer Vision used in the semiconductor industry is through the automated inspection of wafer frontside using both the macro and micro methods. For macro inspection, the entire wafer image is captured and the different defects that may be seen on the wafer are stored in a library. When a similar defect is spotted on a wafer, computer vision is used to match the similarity of the defect and if it is above __%, it will be flagged out. Some examples of macro defects include Scratches, Uneven EBR and Chipping.
For micro inspection, 5 unique points of the wafers are captured and like macro inspection, if a similar defect is spotted on the wafer which can be matched to the defect stored in the library, it will be flagged out. Some examples of micro defects include Residue and Particles.
Some of our computer vision projects include IC packaging 2D, 3D inspection and Products quality check.